Item

Mass Production

Prototype

Surface Treatment

HASL(LF)

HASL(LF)

Immersion Gold

Immersion Gold

Flash Gold

Flash Gold

OSP

OSP

Immersion Tin

Immersion Tin

Immersion Silver

Immersion Silver

HASL & Gold Finger

HASL & Gold Finger

selective nickel

selective nickel

HASL(LF)

SMT Pad: >3um

SMT Pad: >4um

Big Cu: >l um

Big Cu: >l.5 um

Immersion Tin

0.4-0.8um

0.8-1.2um

Immersion Gold

Ni: 2-5urn

Ni: 3-6urn

Au:0.05-0.10um

Au:0.075-0.15um

Immersion Silver

0.2-0.6um

0.3-0.6um

OSP

0.1-0.4um

0.25-0.4um

Flash Gold

Ni: 3-6urn

Ni: 3-6urn

Au:0.01-0.05um

Au:0.02-0.075um

Laminates

CEM-3、PTFE

CEM-3、PTFE

FR- 4(High TG etc)

FR-4(High TG etc)

Metal Base(AL、CU etc)

Metal Base(AL、CU etc)

Rogors、etc

Rogors、etc

MAX．Layers

12(Layers)

12(Layers)

MAX. Board Size

20"X48"

20"X48"

Board Thickness

0.4mm～4.0mm

0.4mm～4.0mm

Max. Copper Thickness

inner Layer: 4oz

inner Layer: 5oz

Outer Layer: 5oz

Outer Layer: 5oz

Min. Track Width

4mil／0.1mm

3mil／0.076mm

Min. Track Space

4mil／0.1mm

3mil／0.076mm

Min  Hole Size

8mil／0.2mm

6mil／0.1mm

Min. Laser Hole Size

4mil／0.1mm

3mil／0.076mm

PTH Wall Thickness

0.8mil／20um

1.2mil／30um

PTH Dia. Tolerance

±3mil/±76um

±2mil/±50um

Aspect Ratio

6:1

10:1

Impedance Control

±10%

±5%